SiC增强铜基复合材料热膨胀系数的理论研究

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引用次数: 0

摘要

电子工业中广泛使用的铜元件的热膨胀系数(CTE)相当高。降低CTE值是非常重要的,以便不因其所暴露的热量而变形。本研究旨在从理论上考察在纯铜中添加SiC时CTE值的变化。为此,根据Kerner和Turner的模型对不同体积倍率的复合材料进行CTE值计算。文献中的样本研究已用于百分比成分比。在这种情况下,强化量被调整为5、10、15和20卷。体积百分比。根据研究结果,基于Kerner模型的CTE值降低了百分之4-17,基于Turner模型的CTE值降低了百分之7-26。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Theoretical Investigation of Thermal Expansion Coefficients of SiC Reinforced Copper Matrix Composites
The thermal expansion coefficient (CTE) of the copper element, which is widely used in the electronics industry, is quite high. It is of great importance to decrease the CTE value in order not to deform against the heat it is exposed to. In this study, it is aimed to theoretically examine the changes in CTE value when SiC supplement is applied to pure copper. For this purpose, CTE value calculations were made according to Kerner and Turner's models for composites that were reinforced at different rates by volume. Sample studies in the literature have been utilized for percent component ratios. In this context, the amount of reinforcement was adjusted to be 5, 10, 15, and 20vol.% by volume. According to the findings, it was observed that there was ̴ %4-17 decrease in CTE value based on the Kerner model and ̴ %7-26 decrease based on the Turner model.
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