铅玻璃与印刷电路板混合熔炼法回收金属及除铅

Journal of Mmij Pub Date : 2020-04-30 DOI:10.2473/journalofmmij.136.25

H. Inano, Keiichi Tomita, Tatsumi Tada, N. Hiroyoshi

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引用次数: 0

摘要

阴极射线管漏斗玻璃等含铅玻璃的还原熔融除铅方法得到了广泛的研究。本文以印刷电路板为还原剂，对铅玻璃模型进行了还原熔融。模型硅酸铅玻璃，减粘剂(na2co3)和印刷电路板混合并在1473 K熔化。在熔融玻璃渣中形成以Pb为主的金属相并沉淀。随着印刷电路板添加量的增加，金属相的数量增加，玻璃渣中残留的PbO浓度降低，说明印刷电路板的添加能有效去除铅玻璃中的铅。通过能谱分析，证实金属相中含有Cu、Ni和Sn，说明印制电路板中的金属被Pb回收。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Metal Recovery and Pb Removal by Melting Mixture of Lead Glass and Printed Circuit Board

Reduction melting methods to remove Pb from lead silicate glasses such as cathode ray tube funnel glass have been extensively studied. In this paper, reduction melting of a model lead glass was conducted using printed circuit board as reductant. Model lead silicate glass, viscosity reducing agent (Na 2 CO 3 ), and printed circuit board were mixed and melted at 1473 K. Metal phase mainly composed of Pb was formed and settled in the melting glass residue. With increasing printed circuit board addition, the amount of metal phase increased and the concentrations of PbO remained in the glass residue decreased, indicating that addition of printed circuit board is effective to remove Pb from the Pb glass. By EDS analysis, it was conﬁrmed that Cu, Ni and Sn are contained in the metal phase, indicating that metals in printed circuit board are recovered with Pb.

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Journal of Mmij

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