G. Djogo, S. Ho, M. Haque, Erden Ertorer, Jianzhao Li, Jun Liu, Xiaolu Song, Jing Suo, P. Herman
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Multi-Core Fiber Socket-Assisted Packaging for 84-Channel Ultra-Dense Silicon Photonics IO
A femtosecond-laser 3D structured silica chip with alignment sockets has permitted precise and compact packaging of multi-core fiber for edge coupling to silicon photonic chips, with average single-pass loss of ∼5.6 dB over 84 channels.
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