合金元素偏析稳定Al-Cu基合金Teta初相界面

M. Petrik, Y. Gornostyrev, P. Korzhavyi
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引用次数: 0

摘要

用从头计算方法系统地研究了al基合金中合金元素(Si,Mg,Mn,Zr,Zn)与θ′相共格界面空位的相互作用。计算结果表明,填充Cu层的界面结构比半填充Cu层的界面结构的能量低(每个结构空位低0.1 eV),这意味着界面可能发生温度诱导的重建。界面Cu层结构中空位的存在对溶质与相干θ′相界面的相互作用起着至关重要的作用。计算出具有闭合(Cu,Zn)或空(Mg,Si) d电子壳层的元素的溶质界面相互作用能比d过渡金属(Mn,Zr)弱得多。为了阐明合金元素和界面结构在θ′相析出稳定性中的作用,我们从电子结构和原子尺寸对原子间键合的贡献两方面分析了溶质-界面相互作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Segregation of Alloying Elements to Stabilize Teta Prime Phase Interfaces in Al-Cu Based Alloys
Interactions of alloying elements (Si,Mg,Mn,Zr,Zn) and vacancies with coherent interfaces of θ′ phase in Al-based alloys have been systematically studied by means of ab initio calculations. The interface structure with a filled interfacial Cu layer is calculated to be lower in energy than the structure with a half-filled Cu layer (by 0.1 eV per structural vacancy), which implies that a temperature-induced reconstruction of the interface may take place. The presence of vacancies in the interfacial Cu layer structure plays a crucial role in the interaction of solutes with a coherent θ′ phase interface. The solute–interface interaction energies are calculated to be much weaker for elements having closed (Cu,Zn) or empty (Mg,Si) d-electron shells than for d-transition metals (Mn,Zr). To clarify the roles of alloying elements and interface structure in the stability of θ′ phase precipitates, we analyze the solute–interface interactions in terms of electronic-structure and atomic-size contributions to interatomic bonding.
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