絮凝剂对金属锌水溶液中铜回收动力学参数影响的研究

A. Kolesnikov, I. Tsyganova
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引用次数: 0

摘要

我们研究了一些描述细锌粉在水溶液中还原铜的模型。实验在带有磁力搅拌器的设备中进行,搅拌速度为40-150 rpm,温度为15-50°C。研究了非离子型magnafloc 333、阳离子型絮凝剂6645和阴离子型絮凝剂4034等高分子絮凝剂对絮凝过程的影响。在工业条件下,这些絮凝剂在水解溶液净化阶段使用,然后与澄清溶液一起进行胶结净化。实验采用含2 ~ 4 g/l锌粉的2、5 g/l水溶液和50 ~ 200 mg/l絮凝剂。通过初步铜向氨络合物的转移,用分光光度法定量测定了初、终溶液中的铜含量。实验时间为1 ~ 8 min,溶液中铜的还原度为10 ~ 90%。结果表明,在低混合速率下,反应动力学可以用一级动力学方程来描述。在高速下,加入絮凝剂所研究的非均相反应动力学可以用速度变化方程作为过程持续时间的平方根来更充分地描述。结果表明,在不添加表面活性剂的情况下,胶结速率常数最高。阴离子絮凝剂对胶结过程的减缓程度小于阳离子絮凝剂,这与电化学过程理论一致,说明在这种条件下铜阳离子的放电限制了胶结过程。随着温度的升高,所研究过程的规律仍然存在。结果表明,相对分子质量为2000万的高分子物质以50 ~ 200 mg/l的加入量对胶结过程有抑制作用。在工业条件下,从含絮凝剂的溶液中进行铜和其他杂质的胶结净化时,必须考虑到这一事实。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigation of flocculant influence on the kinetic parameters of copper recovery in aqueous solution with metal zinc
We studied a number of models for the description of copper reduction by fine zinc powder in aqueous solutions. The experimentswere carried out in devices with a magnetic stirrer at mixing speeds of 40–150 rpm and temperatures of 15–50 °C. We investigated the influence exerted on the process by macromolecular flocculants such as non-ionic magnafloc 333, cationic besflok 6645 and anionic besfloc 4034. Under industrial conditions, these flocculants are used at the hydrolytic solution purification stage and then they are fed to cementing purification together with the clarified solution. Aqueous flocculant solutions of 2,5 g/l containing 2–4 g/l of zinc dust and 50–200 mg/l of flocculant were used in the experiments. Copper content in the initial and final solutions was quantitatively determined by spectrophotometric analysis with the preliminary copper transfer to the ammonia complex. Experiment duration varied from 1 to 8 min. The degree of copper reduction from solutions was 10–90 %. It was found that at low mixing rates the process kinetics can be described by the kinetic equation of the first order. At high speeds, the kinetics of the studied heterogeneous reactionwith added flocculants is more adequately described by the velocity change equation as a square root of the process duration. It wasshown that the highest constant of cementation rate is observed in experiments without the addition of surfactants. Anionic flocculant slows down the cementation process to a lesser extent than cationic one, which is consistent with the theory of electrochemical processes and shows that the discharge of copper cations under these conditions limits the cementation process. Regularities revealed in the studied process remain as temperature increases. It was noted that the addition of high-molecular substances with a relative molecular mass of 20 million in an amount of 50–200 mg/l inhibit the cementation process. This fact must be taken into account in industrial conditions where cementing purification from copper and other impurities is carried out from flocculant-containing solutions.
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