用于质量检测的CMOS-MEMS谐振器中多晶硅压敏电阻的建模与仿真

Mawahib Gafare, M. H. M. Md Khir, A. Rabih, A. Ahmed, J. Dennis
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引用次数: 1

摘要

本文报道了利用商用0.35 μm互补金属氧化物半导体(CMOS)工艺对多晶硅压敏电阻作为传感机构的建模和仿真。CMOS-MEMS谐振器设计用于检测质量变化。所设计的压敏电阻由两种类型组成;纵向和横向。采用CMOS多晶硅薄膜作为压阻式传感材料。采用有限元分析软件CoventorWare对压敏电阻进行仿真,并与模型值进行比较。当驱动电压施加到压敏电阻上时,它会产生电阻的变化,通过电流的变化来检测。模拟应力电流和非应力电流的差值分别为0.28%和0.47%,而横向和纵向压敏电阻的模型和仿真值的差值分别为1.96%和4.54%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling and simulation of polysilicon piezoresistors in a CMOS-MEMS resonator for mass detection
This paper reports modeling and simulation of polysilicon piezoresistors as sensing mechanism using commercial 0.35 μm complementary metal oxide semiconductor (CMOS) process. The CMOS-MEMS resonator is designed to detect change in mass. The designed piezoresistors are composed of two types; longitudinal and transverse. CMOS polysilicon thin film is used as the piezoresistive sensing material. The finite element analysis (FEA) software CoventorWare is adopted to simulate the piezoresistors and hence, compare its values with the modeled one. When actuation voltage is applied to the piezoresistors, it generates a change in resistance which is detected by the change in current. The percentage difference between simulated stressed and unstressed current is found to be 0.28 % and 0.47 % while the difference in the resistance between the model and simulation is 1.96 % and 4.54 % for the transverse and longitudinal piezoresistors, respectively.
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