Vicky O’Donovan, Shay Whiston, A. Deignan, C. N. Chléirigh
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引用次数: 32
摘要
本文重点研究了横向DMOS晶体管中热电子引起的性能退化问题。解释了放弃现有CMOS测试方法的物理理由。本文报道了支持热载流子现象发生的模拟结果,并对20 V LDNMOS和20 V LDPMOS的参数化和实验确定的热电子安全操作区域(HE-SOA)进行了检验。
Hot carrier reliability of lateral DMOS transistors
The focus of this paper is on the degradation induced by hot-electrons in lateral DMOS transistors. The physical justification for the abandonment of the existing CMOS test methods is explained. Simulation results supporting the hot-carrier phenomenon occurring are reported and both parametrically and experimentally determined hot-electron safe-operation-areas (HE-SOA) are examined for reliable device operation of 20 V LDNMOS and 20 V LDPMOS.