金属热界面材料基础

2020 Pan Pacific Microelectronics Symposium (Pan Pacific) Pub Date : 2020-02-01 DOI:10.23919/PanPacific48324.2020.9059395

T. Jensen, R. Lasky

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引用次数: 0

摘要

现代电子学需要极其大量的电路来完成许多令人印象深刻的壮举。例如，现代智能手机的主微处理器中可能有数十亿个逻辑电路。这种电路密度产生了大量必须消散的热量。如果热量没有充分散发，电路的预期寿命和性能将大大降低。

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The Basics of Metal Thermal Interface Materials (TIMs)

Modern electronics require an extremely large number of circuits to perform their many impressive feats. For example, a modern smartphone can have several billion logic circuits in the main microprocessor. This circuit density creates a significant amount of heat that must be dissipated. If the heat is not adequately dissipated, the life expectancy and performance of the circuits are significantly reduced.

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2020 Pan Pacific Microelectronics Symposium (Pan Pacific)

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