利用高光谱成像技术对缺陷相关发光的温度依赖性进行空间和光谱分辨

A. Flø, I. Burud, E. Olsen
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引用次数: 1

摘要

通过高光谱光致发光成像,获得了多晶硅片缺陷相关光致发光的空间分辨和光谱分辨。在300 K(室温)和87 K之间,研究了缺陷相关的辐射作为温度的函数。D1, 0.72 eV, VID3 (0.93 eV)和BB (1,1 eV)在所有温度下都可以检测到,并且随着温度的降低,它们的峰值强度似乎向更高的能量转移。D2信号的峰值能量也有类似的变化,然而,D2信号在室温下是不可见的,在127 K时可以检测到。D3和D4跃迁不表现出光子能量随温度的变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Spatially and spectrally resolved temperature dependence of defect related luminescence using hyperspectral imaging
Spatially and spectrally resolved defect related photoluminescence of multicrystalline Silicon wafers has been obtained through hyperspectral photoluminescence imaging. The defect related emissions has been studied as a function of temperature, between 300 K (room temperature) and 87 K. The emissions D1, 0.72 eV, VID3 (0.93 eV) and BB (1,1 eV) emissions are detectable at all temperatures and their peak intensities seem to shift to higher energies with decreasing temperatures. A similar shift in the peak energy for the D2 signal is measured, however, the D2 signal is not visible at room temperature and becomes detectable at 127 K. The D3 and D4 transitions do not exhibit a shift in photon energy with temperature.
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