C. Henning, A. Schmid, Sophia Hecht, Cindy Rückmar, K. Harre, R. Bauer
{"title":"生物基聚合物在PCB中的可用性","authors":"C. Henning, A. Schmid, Sophia Hecht, Cindy Rückmar, K. Harre, R. Bauer","doi":"10.1109/ISSE.2019.8810257","DOIUrl":null,"url":null,"abstract":"The need for alternatives for petrochemical circuit board materials is increasing annually. This paper deals with the study of ternary PLA composites, containing cellulose acetate (CA) and zinc pyrophosphate (ZnPP), the comparison to previous binary PLA composites and their usability as wiring substrates. For this purpose, principles of assembly and connection technologies are applied to the PLA composite and evaluated. The polymer thick-film technology and the printed circuit technology are used as principles of the assembly and connection technology for the realization of conductive structures. Furthermore, the assembly of components on copper conductive bonding and the mechanical strength of the joints was tested. Thus, an overview of the applicability of PLA composites as alternative circuit board materials as well as the advantages and disadvantages can be shown.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"5 1","pages":"1-7"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Usability of Bio-based Polymers for PCB\",\"authors\":\"C. Henning, A. Schmid, Sophia Hecht, Cindy Rückmar, K. Harre, R. Bauer\",\"doi\":\"10.1109/ISSE.2019.8810257\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The need for alternatives for petrochemical circuit board materials is increasing annually. This paper deals with the study of ternary PLA composites, containing cellulose acetate (CA) and zinc pyrophosphate (ZnPP), the comparison to previous binary PLA composites and their usability as wiring substrates. For this purpose, principles of assembly and connection technologies are applied to the PLA composite and evaluated. The polymer thick-film technology and the printed circuit technology are used as principles of the assembly and connection technology for the realization of conductive structures. Furthermore, the assembly of components on copper conductive bonding and the mechanical strength of the joints was tested. Thus, an overview of the applicability of PLA composites as alternative circuit board materials as well as the advantages and disadvantages can be shown.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"5 1\",\"pages\":\"1-7\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810257\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810257","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The need for alternatives for petrochemical circuit board materials is increasing annually. This paper deals with the study of ternary PLA composites, containing cellulose acetate (CA) and zinc pyrophosphate (ZnPP), the comparison to previous binary PLA composites and their usability as wiring substrates. For this purpose, principles of assembly and connection technologies are applied to the PLA composite and evaluated. The polymer thick-film technology and the printed circuit technology are used as principles of the assembly and connection technology for the realization of conductive structures. Furthermore, the assembly of components on copper conductive bonding and the mechanical strength of the joints was tested. Thus, an overview of the applicability of PLA composites as alternative circuit board materials as well as the advantages and disadvantages can be shown.
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