M. Feißt, Jan Kustermann, A. Schumacher, Irina Spies, J. Wilde
{"title":"基于箔片的瞬态液相粘接模具工艺优化","authors":"M. Feißt, Jan Kustermann, A. Schumacher, Irina Spies, J. Wilde","doi":"10.1109/ISSE.2019.8810295","DOIUrl":null,"url":null,"abstract":"In this work investigations on TLP-bonding with a binary alloy consisting of Ag and Sn are presented. This joining technology allows stress-reduced mounting with a temperature-stable metallic interconnection. To analyze the influence of the process parameters a bonding-press that is capable of high heating rates up to 25 K/s was built and methods of DoE were used. The bonding pressure showed the most significant impact, while heating rate, time and temperature had a minor influence. The influence on the microporosity is demonstrated by SEM micrographs of ion-milled cross sections.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"22 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Process Optimization of Foil-Based Transient Liquid Phase Bonding for Die Attachment\",\"authors\":\"M. Feißt, Jan Kustermann, A. Schumacher, Irina Spies, J. Wilde\",\"doi\":\"10.1109/ISSE.2019.8810295\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work investigations on TLP-bonding with a binary alloy consisting of Ag and Sn are presented. This joining technology allows stress-reduced mounting with a temperature-stable metallic interconnection. To analyze the influence of the process parameters a bonding-press that is capable of high heating rates up to 25 K/s was built and methods of DoE were used. The bonding pressure showed the most significant impact, while heating rate, time and temperature had a minor influence. The influence on the microporosity is demonstrated by SEM micrographs of ion-milled cross sections.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"22 1\",\"pages\":\"1-6\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810295\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810295","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Process Optimization of Foil-Based Transient Liquid Phase Bonding for Die Attachment
In this work investigations on TLP-bonding with a binary alloy consisting of Ag and Sn are presented. This joining technology allows stress-reduced mounting with a temperature-stable metallic interconnection. To analyze the influence of the process parameters a bonding-press that is capable of high heating rates up to 25 K/s was built and methods of DoE were used. The bonding pressure showed the most significant impact, while heating rate, time and temperature had a minor influence. The influence on the microporosity is demonstrated by SEM micrographs of ion-milled cross sections.
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