一种快速、低成本的TSV/TGV充填方法

2017 China Semiconductor Technology International Conference (CSTIC) Pub Date : 2017-03-12 DOI:10.1109/CSTIC.2017.7919862

Jiebin Gu, Bingjie Liu, Heng Yang, Xinxin Li

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引用次数: 1

摘要

本文提出了一种不需要预先金属化过孔的合金过孔填充方法，可以在晶圆级上实现。不同几何形状的硅通孔(TSV)/玻璃通孔(TGV)可以在几分钟内同时填充，而不是通过电镀几个小时。制造了一种用于该合金通过填充法的专用设备。本文提出的合金TSV填充方法具有工业应用潜力。

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A fast and low-cost TSV/TGV filling method

In this paper, we present an alloy via-filling method that does not need pre-metallization of via holes and can be realized on wafer level. Through-Silicon Via(TSV)/Through Glass Via(TGV) with different geometries can be filled simultaneously in few minutes, instead of few hours by electroplating. A specific equipment is made for the alloy via-filling method. The alloy TSV filling method presented in this paper has the potential for industrial applications.

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来源期刊

2017 China Semiconductor Technology International Conference (CSTIC)

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