共蒸发薄膜和熔纺带状Al1−xMnx合金中的电子输运

V. Nguyen Van, S. Fisson, K. Yu-Zhang, M. Harmelin
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引用次数: 1

摘要

在两种表征良好的Al1−xMnx合金样品上进行了直流电阻率(30 ~ 300 K)和热电功率(80 ~ 300 K)的精确测量:非晶薄膜(10 at。% < x≤14 at.%)通过共蒸发沉积在冷衬底上,Al89Mn11熔融纺丝带处于准晶(制备)和晶(退火)状态。结果进行了比较,强调了输运性质对结构变化的敏感性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electron transport in co-evaporated thin film and melt-spun ribbon Al1−xMnx alloys

Accurate measurements of the d.c. electrical resistivity (between 30 and 300 K) and of the thermoelectric power (between 80 and 300 K) were performed on two types of well-characterized Al1−xMnx alloy samples: amorphous thin films (with 10 at.% ⩽ x ⩽ 14 at.%) deposited by co-evaporation on cold substrates, and Al89Mn11 melt-spun ribbon in quasi-crystalline (asprepared) and crystalline (annealed) states. The results are compared and emphasize the sensitivity of the transport properties to structural changes.

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