{"title":"InP PIC的数据中心应用的可扩展性","authors":"B. Docter, K. Solis-Trapala, A. Albores-Mejia","doi":"10.1364/OFC.2019.TH3A.5","DOIUrl":null,"url":null,"abstract":"InP PIC fabrication platforms have seen an accelerated development over the recent years. Monolithic integration allows novel concepts in packaging and testing technology. Altogether they enable a ready to scale cost-effective InP PIC ecosystem.","PeriodicalId":6704,"journal":{"name":"2019 Optical Fiber Communications Conference and Exhibition (OFC)","volume":"6 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"InP PIC's Scalability for Datacenter Applications\",\"authors\":\"B. Docter, K. Solis-Trapala, A. Albores-Mejia\",\"doi\":\"10.1364/OFC.2019.TH3A.5\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"InP PIC fabrication platforms have seen an accelerated development over the recent years. Monolithic integration allows novel concepts in packaging and testing technology. Altogether they enable a ready to scale cost-effective InP PIC ecosystem.\",\"PeriodicalId\":6704,\"journal\":{\"name\":\"2019 Optical Fiber Communications Conference and Exhibition (OFC)\",\"volume\":\"6 1\",\"pages\":\"1-1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-03-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 Optical Fiber Communications Conference and Exhibition (OFC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/OFC.2019.TH3A.5\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Optical Fiber Communications Conference and Exhibition (OFC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/OFC.2019.TH3A.5","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
InP PIC fabrication platforms have seen an accelerated development over the recent years. Monolithic integration allows novel concepts in packaging and testing technology. Altogether they enable a ready to scale cost-effective InP PIC ecosystem.
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