G. Bombardi, A. Marchioro, T. Vergine, F. Bouyjou, F. Guilloux, S. Callier, F. Dulucq, M. Berni, C. de La Taille, L. Raux, D. Thienpont, S. Extier, M. Firlej, T. Fiutowski, M. Idzik, J. Moroń, K. Swientek
{"title":"HGCROC-Si和HGCROC-SiPM: CMS HGCAL的前端读出asic","authors":"G. Bombardi, A. Marchioro, T. Vergine, F. Bouyjou, F. Guilloux, S. Callier, F. Dulucq, M. Berni, C. de La Taille, L. Raux, D. Thienpont, S. Extier, M. Firlej, T. Fiutowski, M. Idzik, J. Moroń, K. Swientek","doi":"10.1109/NSS/MIC42677.2020.9508012","DOIUrl":null,"url":null,"abstract":"1 Abstract—The two variants of HGCROC are the ASICs designed to readout the more than 6 million channels of the future HGCAL of CMS, which will consist of hexagonal silicon sensors for a large part but also SiPM-on-scintillators tiles. The SiPM version of the chip was made from the silicon version by adapting only the first amplifier stage. The first aspect is on the performance for both versions in terms of noise, charge and timing, the DAQ and Trigger paths, as well as results from irradiation qualification with total ionizing dose and heavy ions for single-event effects. The third version of HGCROC chip is a major digital release, with RadHard solutions and an additional buffer.","PeriodicalId":6760,"journal":{"name":"2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)","volume":"63 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"HGCROC-Si and HGCROC-SiPM: the front-end readout ASICs for the CMS HGCAL\",\"authors\":\"G. Bombardi, A. Marchioro, T. Vergine, F. Bouyjou, F. Guilloux, S. Callier, F. Dulucq, M. Berni, C. de La Taille, L. Raux, D. Thienpont, S. Extier, M. Firlej, T. Fiutowski, M. Idzik, J. Moroń, K. Swientek\",\"doi\":\"10.1109/NSS/MIC42677.2020.9508012\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"1 Abstract—The two variants of HGCROC are the ASICs designed to readout the more than 6 million channels of the future HGCAL of CMS, which will consist of hexagonal silicon sensors for a large part but also SiPM-on-scintillators tiles. The SiPM version of the chip was made from the silicon version by adapting only the first amplifier stage. The first aspect is on the performance for both versions in terms of noise, charge and timing, the DAQ and Trigger paths, as well as results from irradiation qualification with total ionizing dose and heavy ions for single-event effects. The third version of HGCROC chip is a major digital release, with RadHard solutions and an additional buffer.\",\"PeriodicalId\":6760,\"journal\":{\"name\":\"2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)\",\"volume\":\"63 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-10-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/NSS/MIC42677.2020.9508012\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NSS/MIC42677.2020.9508012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
HGCROC-Si and HGCROC-SiPM: the front-end readout ASICs for the CMS HGCAL
1 Abstract—The two variants of HGCROC are the ASICs designed to readout the more than 6 million channels of the future HGCAL of CMS, which will consist of hexagonal silicon sensors for a large part but also SiPM-on-scintillators tiles. The SiPM version of the chip was made from the silicon version by adapting only the first amplifier stage. The first aspect is on the performance for both versions in terms of noise, charge and timing, the DAQ and Trigger paths, as well as results from irradiation qualification with total ionizing dose and heavy ions for single-event effects. The third version of HGCROC chip is a major digital release, with RadHard solutions and an additional buffer.
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