回流炉内气体流量的测量

M. Hurban, I. Szendiuch
{"title":"回流炉内气体流量的测量","authors":"M. Hurban, I. Szendiuch","doi":"10.1109/ISSE.2019.8810150","DOIUrl":null,"url":null,"abstract":"Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"57 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Measurement of Gas Flow in Reflow Oven\",\"authors\":\"M. Hurban, I. Szendiuch\",\"doi\":\"10.1109/ISSE.2019.8810150\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"57 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810150\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810150","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

回流炉内部气体流量的测量是一个非常重要的问题,有助于优化传热,降低机器的功耗。如今,我们正在使用无铅焊料合金和优化的轮廓是高质量的焊接接头和尽可能低的空穴率的必要条件。在医疗和汽车领域,这些技术方法非常重要。我们的目标是可靠的生产,这意味着可靠的产品。这是延长电子产品使用寿命的基础。三维气体流量测量设备是实现这一目标的重要手段之一。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Measurement of Gas Flow in Reflow Oven
Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信