测量固体薄膜厚度的新技术

C. Desai
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引用次数: 0

摘要

提出了一种测量固体薄膜厚度参数的新方法。利用真空蒸发装置,在10−5托的真空条件下制备了银、铝和锑的各种薄膜。胶卷被一枚细金属大头针划伤了。通过采用半镀银圆柱凸透镜,在镀银划痕膜和圆柱透镜之间建立了点接触。在薄膜表面得到了多束菲索干涉条纹。在划痕的台阶上,由于高度差,条纹发生了位移。由于点接触轴的存在,使得环序的分配没有歧义。银、铝和锑薄膜的厚度已经非常精确地测定出来。该技术具有较高的分辨率和良好的再现性,并对其影响进行了讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A New Technique for Measuring Thickness of Thin Solid Films
A new technique has been developed for measuring the thickness parameter for any thin solid films. Various thin films of silver, aluminium and antimony have been prepared by using vacuum evaporation plant at the vacuum of 10−5 torr. The films have been scratched by a fine metal pin. By employing a semi-silvered cylindrical convex lens, a point contact has been established between a silvered scratch-film and a cylindrical lens. Multiple beam Fizeau interference fringes have been obtained over the surface of thin films. Across the step of the scratch, because of height difference, the shift in the fringes have been observed. Due to the axis of point contact, no ambiguity in allocation of ringe order has been obtained. The thicknesses of silver, aluminium and antimony thin films have been determined very precisely. The technique gives high resolution with a good degree of reproducibility and implications are discussed.
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