晶圆对晶圆对准技术

R.L. Smith, S.D. Collins
{"title":"晶圆对晶圆对准技术","authors":"R.L. Smith,&nbsp;S.D. Collins","doi":"10.1016/0250-6874(89)80131-3","DOIUrl":null,"url":null,"abstract":"<div><p>A simple, inexpensive and reliable wafer-to-wafer alignment technique is presented for use in the fabrication of microsensors and microactuators. The technique provides ±5 μm alignment precision and requires no special optical or mechanical fixtures.</p></div>","PeriodicalId":101159,"journal":{"name":"Sensors and Actuators","volume":"20 3","pages":"Pages 315-316"},"PeriodicalIF":0.0000,"publicationDate":"1989-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0250-6874(89)80131-3","citationCount":"10","resultStr":"{\"title\":\"A wafer-to-wafer alignment technique\",\"authors\":\"R.L. Smith,&nbsp;S.D. Collins\",\"doi\":\"10.1016/0250-6874(89)80131-3\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>A simple, inexpensive and reliable wafer-to-wafer alignment technique is presented for use in the fabrication of microsensors and microactuators. The technique provides ±5 μm alignment precision and requires no special optical or mechanical fixtures.</p></div>\",\"PeriodicalId\":101159,\"journal\":{\"name\":\"Sensors and Actuators\",\"volume\":\"20 3\",\"pages\":\"Pages 315-316\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/0250-6874(89)80131-3\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Sensors and Actuators\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/0250687489801313\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Actuators","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0250687489801313","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10

摘要

提出了一种简单、廉价、可靠的晶圆对晶技术,用于微传感器和微致动器的制造。该技术提供±5 μm的对准精度,不需要特殊的光学或机械夹具。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A wafer-to-wafer alignment technique

A simple, inexpensive and reliable wafer-to-wafer alignment technique is presented for use in the fabrication of microsensors and microactuators. The technique provides ±5 μm alignment precision and requires no special optical or mechanical fixtures.

求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信