采用聚合物封装方法生产的新型大面积a- si组件

Proceedings of 1994 IEEE 1st World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC and PSEC) Pub Date : 1994-12-05 DOI:10.1109/WCPEC.1994.520016

K. Hayashi, A. Ishikawa, Toshihito Endho, H. Yamagishi

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引用次数: 5

摘要

研制了一种新型的非晶态硅太阳能组件，其背面采用铺层法包裹热固性聚合物。为此，选择了聚烯烃低聚物作为包封层，并对包封工艺进行了研究。在几种类型的加速测试中，这些模块的电气性能变化很小。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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New type of large-area a-Si module produced using a polymer encapsulation method

A new type of amorphous silicon (a-Si) solar module has been developed, the back surface of which is encapsulated with a thermosetting polymer by using a spreading method. For this purpose, poly-olefin oligomer was chosen as an encapsulation layer and the process has been investigated. The modules show very little change in electrical performance under several types of acceleration test.

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来源期刊

Proceedings of 1994 IEEE 1st World Conference on Photovoltaic Energy Conversion - WCPEC (A Joint Conference of PVSC, PVSEC and PSEC)

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