系统级封装应用的紧凑型微波双工器设计

Chi‐Feng Chen, Guo-Yun Wang, Bo-Hao Tseng, Ting Lin
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引用次数: 4

摘要

提出了一种用于系统级封装的小尺寸高隔离微波双工器。通过采用折叠阶跃阻抗谐振器(SIRs),可以显著减小电路的整体尺寸。为了演示,利用微带技术设计并制作了工作在0.5 GHz和0.86 GHz的三阶切比舍夫带通双工器。因此,双工器占用很小的尺寸,即0.14 λg × 0.12 λg。实测结果与仿真结果吻合较好。输出隔离和带外抑制优于60 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of compact microwave diplexer for system-in-a-package applications
A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 λg by 0.12 λg. The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.
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