极紫外器件辐射污染监测技术

王珣 Wang Xun, 金春水 Jin Chunshui, 匡尚奇 Kuang Shang-qi, 喻波 Yu Bo
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引用次数: 0

摘要

本文综述了极紫外光刻(EUVL)中污染的“原位”表面分析和监测技术。介绍了极紫外光刻技术、反射式多层反射镜以及极紫外光引起碳污染的机理。指出了在极紫外光刻中对“原位”表面分析技术的要求。讨论了主要的表面分析技术。分析结果表明了每一种测量方法在EUV光学系统中的应用潜力。最后,指出光纤椭偏振在EUV光刻“原位”表面污染监测中具有进一步的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Techniques of radiation contamination monitoring for extreme ultraviolet devices
This paper reviews the "in situ"surface analysis and monitoring techniques for contamination induced in Extreme Ultraviolet Lithography( EUVL). It introduces the EUV lithography,reflective multilayer mirror and the mechanism of carbon contamination induced by EUV. It points out the requirement of the "in situ"surface analysis techniques in EUV lithography. The mainly surface analysis techniques are discussed. Analyzed results show the applied potentiality of each measurement used in the EUV optical system. Finally,it points out that the Fiber-based ellipsometry has further application prospect in "in situ"surface contamination monitoring of EUV lithography.
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