IC人员是在帮助还是阻碍电路板测试?

Z. Conroy
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引用次数: 0

摘要

随着印刷电路板测试点的减少,向高密度互连(HDI)的转变以及涉及高速路由信号完整性验证的持续要求,电路板测试变得越来越复杂。在电路板级测试和多供应商嵌入式仪器访问和解决方案中,集成电路中的嵌入式仪器的帮助变得至关重要。特别是,为了验证电路板的高速运行并弥补结构测试能力的损失,必须使用嵌入式仪器进行内置ic到ic测试。许多集成电路已经使用这些仪器进行集成电路级测试,但是它们的功能需要扩展,以便在板级测试中重复使用。然而,一个潜在的障碍是,IC供应商经常使这些仪器专有,通常具有定制功能和访问权限。能否就提供“标准化功能和开放访问”达成一致,并通过“标准化文档”从IC设计界转移到制造板测试?这需要IC设计、IC测试、电路板设计和测试工程师紧密合作,就测试仪器的功能和特性达成一致。电路板工程师知道他们需要一些东西,但可能不知道什么是可用的,或者他们在游戏中解决IC设计要求太晚了!小组的目标如下:-提高IC设计和测试社区的意识,IC中的嵌入式仪器和多供应商嵌入式仪器访问和解决方案的帮助对板测试的未来成功至关重要。-讨论在电路板级测试中重复使用适用IC仪器的行业接受度,并讨论开放仪器访问的潜在利弊。-就IC中标准化仪器的设计提供意见,旨在将信息传递给客户,并在IC设计,测试,验证和表征中增加电路板设计和制造测试要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Are the IC guys helping or hindering board test?
With the erosion of printed circuit board test points, a shift to high density interconnect (HDI) and continuing requirements that involve signal integrity verification of high-speed routes, board test is becoming much more complex. Assistance from embedded instruments in the ICs at board level test and multi-vendor embedded instrument access and solutions are becoming critical. In particular, to verify the board runs at-speed and to compensate for the loss of structural test capability, built-in IC-to-IC tests using embedded instruments will become a must. Many ICs already use these instruments for IC level testing, however their function needs to be extended for re-use at board-level test. However, a potential roadblock to this is that IC providers frequently make these instruments proprietary, often with custom functions and access. Can agreement be reached on providing "standardized functions and open access", that can be transferred by "standardized documentation" from the IC design community to manufacturing board test? This requires IC design, IC test, and board design and test engineers to work closely together to agree on the function and features of the test instruments. The board engineers know they need something, but possibly do not know what is available or they address the IC design requirements too late in the game! The objectives of the panel are as follows: — To increase awareness of the IC design and test communities that assistance from embedded instruments in ICs and multi-vendor embedded instrument access and solutions are critical to the future success of board test. — Discuss the industry acceptance to re-use applicable IC instruments at board level test, as well as argue the potential pros and cons of open instrument access. — Provide opinions on designing standardized instruments in ICs, with the intent of passing the information on to customers, as well as adding board design and manufacturing test requirements to IC design, test, verification and characterization.
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