等离子体互连-一个密集和快速的互连解决方案

2017 IEEE Photonics Conference (IPC) Part II Pub Date : 2017-10-01 DOI:10.1109/PC2.2017.8283361

Juerg Leuthold, C. Hoessbacher, W. Heni, C. Haffner, Y. Salamin, U. Koch, M. Ayata, Y. Fedoryshyn, B. Baeuerle, A. Josten, D. Elder, Larry R. Dalton

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引用次数: 0

摘要

等离子体互连被提出作为一种解决方案，以提供互连密度不匹配的电子和带宽超过100千兆赫。超快和紧凑的等离子调制器和探测器等关键元素已经经过测试，首次演示证实了该技术的可行性。

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Plasmonic interconnects - a dense and fast interconnect solution

Plasmonic interconnects are proposed as a solution to offer interconnect densities not to be matched by electronics and with bandwidths exceeding 100 GHz. Key elements such as ultrafast and compact plasmonic modulators and detectors have already been tested and first demonstrations confirm the viability of the technology.

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2017 IEEE Photonics Conference (IPC) Part II

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