基于薄膜SOI技术的CMOS兼容三维自组装微结构

Proceedings of IEEE Sensors, 2004. Pub Date : 2004-01-01 DOI:10.1109/ICSENS.2004.1426371

F. Iker, M. Si Moussa, N. André, T. Pardoen, J. Raskin

{"title":"基于薄膜SOI技术的CMOS兼容三维自组装微结构","authors":"F. Iker, M. Si Moussa, N. André, T. Pardoen, J. Raskin","doi":"10.1109/ICSENS.2004.1426371","DOIUrl":null,"url":null,"abstract":"3D self-assembled microstructures are processed based on thin film SOI wafers. Self assembled structures going from meander inductors to flow sensors are obtained from using only one photolithographic step. The assembly of our microstructures relies on the thermal expansion mismatch between the material layers as well as control of the plastic flow of one of the layers.","PeriodicalId":20476,"journal":{"name":"Proceedings of IEEE Sensors, 2004.","volume":"244 1","pages":"1113-1116 vol.3"},"PeriodicalIF":0.0000,"publicationDate":"2004-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"CMOS compatible 3-D self assembled microstructures using thin film SOI technology\",\"authors\":\"F. Iker, M. Si Moussa, N. André, T. Pardoen, J. Raskin\",\"doi\":\"10.1109/ICSENS.2004.1426371\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"3D self-assembled microstructures are processed based on thin film SOI wafers. Self assembled structures going from meander inductors to flow sensors are obtained from using only one photolithographic step. The assembly of our microstructures relies on the thermal expansion mismatch between the material layers as well as control of the plastic flow of one of the layers.\",\"PeriodicalId\":20476,\"journal\":{\"name\":\"Proceedings of IEEE Sensors, 2004.\",\"volume\":\"244 1\",\"pages\":\"1113-1116 vol.3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Sensors, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSENS.2004.1426371\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Sensors, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSENS.2004.1426371","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

基于薄膜SOI晶圆制备三维自组装微结构。从曲流电感器到流量传感器的自组装结构只需要一个光刻步骤。我们的微结构的组装依赖于材料层之间的热膨胀不匹配以及控制其中一层的塑性流动。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

CMOS compatible 3-D self assembled microstructures using thin film SOI technology

3D self-assembled microstructures are processed based on thin film SOI wafers. Self assembled structures going from meander inductors to flow sensors are obtained from using only one photolithographic step. The assembly of our microstructures relies on the thermal expansion mismatch between the material layers as well as control of the plastic flow of one of the layers.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of IEEE Sensors, 2004.

自引率

0.00%

发文量