{"title":"PC主板散热策略的优化","authors":"R. Jano, A. Fodor","doi":"10.1109/ISSE.2019.8810263","DOIUrl":null,"url":null,"abstract":"The present paper aims to study the efficiency of the classical cooling method used for dissipating power from microprocessors: a fan placed on top of a heat sink and the impact this setup has on the surrounding thermally critical components placed near the CPU. It then suggests a better placement of the fan in order to define a safe area in which these components could be placed, without impacting the efficiency of heat extraction.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"48 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimizations for Heat Dissipation Strategies on PC Motherboards\",\"authors\":\"R. Jano, A. Fodor\",\"doi\":\"10.1109/ISSE.2019.8810263\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The present paper aims to study the efficiency of the classical cooling method used for dissipating power from microprocessors: a fan placed on top of a heat sink and the impact this setup has on the surrounding thermally critical components placed near the CPU. It then suggests a better placement of the fan in order to define a safe area in which these components could be placed, without impacting the efficiency of heat extraction.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"48 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810263\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810263","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optimizations for Heat Dissipation Strategies on PC Motherboards
The present paper aims to study the efficiency of the classical cooling method used for dissipating power from microprocessors: a fan placed on top of a heat sink and the impact this setup has on the surrounding thermally critical components placed near the CPU. It then suggests a better placement of the fan in order to define a safe area in which these components could be placed, without impacting the efficiency of heat extraction.
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