前言:电子器件和元件热管理研讨会长笛2021特刊

IF 1.5 4区 工程技术 Q3 ENGINEERING, MECHANICAL
B. Sikarwar, K. Singh, Balkrishna Mehta
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引用次数: 0

摘要

国际流体与热工程研讨会(FLUTE 2021)是由印度北方邦阿姆ity大学阿姆ity工程技术学院机械工程系于2021年7月22日组织的国际同行评审学术研讨会。长笛2021提供了一个论坛,以促进研究人员,科学家和工程师在流体和热工领域之间的快速沟通和交流思想。长笛2021的主题是“电子器件和组件的热管理”。在过去的十年中,随着制造技术的快速发展,电子元件和设备面临着(1)多功能和(2)小型化的发展趋势,同时需要更大的电子功率和更小的芯片组件尺寸。因此,防止电子设备过热的挑战越来越大,严重影响电子设备的工作效率和使用寿命。因此,有效的热管理方法对于保证电子元件的正常工作效率和安全至关重要。一般来说,电子设备和元件的热管理技术可分为两类:(i)主动冷却和(ii)被动冷却。然而,主动冷却对于小型电子设备来说是非常有限的,因为它通常需要足够的空间和额外的功率。它也有高噪音水平和维护困难的问题。因此,可靠的被动冷却对于改善小型电子元件的热性能和寿命周期变得至关重要和有吸引力。这期特刊发表了电子器件和元件热管理方面的研究成果。这些文章为现有的知识体系做出了贡献,并为长笛2021的主题提供了新的见解和观点。被邀请的作者是那些通过理论和实证研究调查对各种环境下的各种技术进行研究的人。本期特刊由六篇研究文章组成,这些文章是长笛2021上发表的论文的扩展版本。此外,其他知名作者提交的关于长笛2021主题的论文也被考虑在内。通过对《强化传热杂志》(JEHT)的严格审查,最终做出了最终决定。第一篇论文介绍了一种基于相变材料(PCM)的电子冷却混合散热器的实验研究。在第二篇论文中,讨论了下一代电子器件喷雾冷却系统的实验研究。第三篇论文给出了管径对紧凑换热器中PCM凝固影响的数值研究。第四篇论文提出了一种利用格点-玻尔兹曼方法对后向台阶内分区通道的对流和共轭传热效率提高进行研究。第五篇论文提出了一种新的栅格-波尔兹曼法微通道共轭传热模型离散化策略。在第六篇论文中,作者研究了时变阶跃函数激励下单线电缆的温度计算。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS
The International Symposium on Fluids and Thermal Engineer g, FLUTE 2021, is an international peer-reviewed academic symposium organized b y the Department of Mechanical Engineering at Amity School of Engineering & Technology, Am ity University Uttar Pradesh, India on July 22, 2021. FLUTE 2021 provides a forum to promote rapid communication and exchange ideas between researchers, scientists, and engin e rs the field of fluid and thermal engineering. The theme of FLUTE 2021 was “Thermal Managemen t of Electronic Devices and Components.” With the rapid growth of manufacturing technologies during the past decade, electronic components and devices are exposed to the developing trends for (i) multi-functionality and (ii) miniaturization that simultaneously requires larger elec tronic power and smaller chip component sizes. Consequently, there are increasing challenges for preventing electronic devices from overheating, which badly affects their working efficiency a nd lifetime. Hence, an effective thermal management approach is essential for guaranteeing the n ormal working efficiency and safety of electronic components. In general, the thermal manageme nt techniques of electronic devices and components could be classified into two categories: (i) a ctive cooling and (ii) passive cooling. However, active cooling becomes highly limited for min iaturized electronic devices because it usually requires sufficient space and additional power. I t also has the issues of high noise levels and difficulty in maintenance. For this reason, reliable pas sive cooling has become essential and attractive for improving the thermal performance and life c ycle of small electronic components. This special issue publishes the research outcomes on the th ermal management of electronic devices and components. The articles contribute to the exis ting body of knowledge and provide new insights and perspectives on the theme of FLUTE 2021. The invit d authors are those who were conducting research on a variety of technologies in var ious settings through theoretical and empirical research investigations. This special issue consists of six research articles that are extended versions of the papers presented in FLUTE 2021. Als o, the papers submitted by other renowned authors working on the theme of FLUTE 2021 were also considered. The rigorous review process of the Journal of Enhanced Heat Transfer (JEHT) was followed to reach a final decision. The first paper presents an experimental study of a phase chan ge material (PCM)-based hybrid heat sink for electronic cooling. In the second paper , an experimental investigation of the spray cooling system for next-generation electronic de vices is discussed. The third paper presents the numerical study of tube diameter effects on the solidification of PCM in a compact heat exchanger. The fourth paper proposes a study on convect ive and conjugate heat transfer efficiency enhancement over the partitioned channel within a backward-facing step using the Lattice–Boltzmann method. The fifth paper presents a new dis cret zation strategy for microchannel conjugate heat transfer modeling using the Lattice–Bol tzmann method. In the sixth paper, the authors present a study on temperature calculation for sing le-wire cables with time-varying step function excitations.
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来源期刊
Journal of Enhanced Heat Transfer
Journal of Enhanced Heat Transfer 工程技术-工程:机械
CiteScore
3.60
自引率
8.70%
发文量
51
审稿时长
12 months
期刊介绍: The Journal of Enhanced Heat Transfer will consider a wide range of scholarly papers related to the subject of "enhanced heat and mass transfer" in natural and forced convection of liquids and gases, boiling, condensation, radiative heat transfer. Areas of interest include: ■Specially configured surface geometries, electric or magnetic fields, and fluid additives - all aimed at enhancing heat transfer rates. Papers may include theoretical modeling, experimental techniques, experimental data, and/or application of enhanced heat transfer technology. ■The general topic of "high performance" heat transfer concepts or systems is also encouraged.
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