脉冲激光沉积(PLD)制备无分层、低应力类金刚石(DLC)薄膜

A. Arjunan, K. Balasundaram, Purushottam Kumar, Jaeseok Lee, Sang Yoon, S. Kim, Sushant Gupta, R. Singh
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引用次数: 7

摘要

由于高残余应力,类金刚石(DLC)薄膜的粘附性差和分层一直是厚(>1 μm) DLC薄膜面临的长期挑战。在这项研究中,采用多周期脉冲激光沉积(MCPLD)技术在石墨靶上沉积无分层和低应力的DLC薄膜。MCPLD制备的微米厚薄膜的残余应力值为2 GPa,而常规或单周期脉冲激光沉积(SCPLD)的残余应力值为9 GPa。由于MCPLD工艺制备的DLC薄膜的残余应力很低,因此完全没有发生粘附破坏。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of Delamination Free, Low Stress Diamond Like Carbon (DLC) Films Using Pulsed Laser Deposition (PLD)
Poor adhesion and delamination of diamond-like carbon(DLC) films due to high residual stresses has been a long standing challenge for thick (>1 μm) DLC films. In this study, delamination-free and low stress DLC films were deposited using multi-cycle pulsed laser deposition (MCPLD) from a graphite target. Residual stress values of a micron thick film prepared by MCPLD was 2 GPa, as compared to 9 GPa in films deposited by conventional or single cycle pulsed laser deposition (SCPLD). Adhesion failure was completely absent in the DLC films prepared by the MCPLD process owing to such low residual stress.
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来源期刊
Electrochemical and Solid State Letters
Electrochemical and Solid State Letters 工程技术-材料科学:综合
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