热处理温度对离心铸造带状Ti-Ni合金元件形状记忆特性的影响

Chikara Nakagawa, H. Fujiki, Hiroki Cho
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引用次数: 0

摘要

生长SBO晶体。(A)生长中的SBO晶体上出现空洞。圆圈和钻石分别表示空隙和杂质。白色和黑色箭头对应晶体生长方向(与向下拉方向相反)和空洞的逃逸方向。VG:增长率;VC:恒空率。(B) - (D)包含发生的两种模式。生长条件:(B) VG < VC;(c) vg≓vc;(d) vg > vc。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Heat-treatment Temperature on Shape Memory Characteristics of a Tape-shaped Ti-Ni Alloy Element Fabricated by a Centrifugal Casting Method
growing SBO crystals. (A) Voids appear on a growing SBO crystal. Circles and diamonds indicate voids and impurities, respectively. White and black arrows correspond to the directions of crystal growth (the opposite of pulling-down direction) and escape of voids. VG: growth rate; VC: constant rate of voids. (B)–(D) Two modes of inclusion occurrence. Growth conditions: (B) VG < VC; (C) VG ≓ VC; (D) VG > VC.
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