远程微波等离子体增强SiO2薄膜化学气相沉积:氧等离子体诊断

C. Regnier, J. Desmaison, P. Tristant, D. Merle
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引用次数: 4

摘要

采用微波等离子体增强化学气相沉积(RMPECVD)技术制备氧化硅。在微波放电中激发氧气制备二氧化硅薄膜,同时在下游引入5%硅烷在氩气中稀释的混合物。在余辉中,双朗缪尔探针测量和从光学发射光谱(OES)推断的旋转温度表明,当压力增加(19 - 26 Pa)时,电子能量转移到气体中。因此电子温度从22000 K下降到11000 K,气体温度从400 K上升到500 K。此外,微波功率(180 -480 W)对沉积速率和sio2涂层质量(在HF溶液中的密度和蚀刻速率)也有影响。这种效应与电子密度(0.7.10 - 10 ~ 3.7.10 - 10 cm -3)和气体温度(400 ~ 460 K)的增加有关。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Remote microwave plasma enhanced chemical vapour deposition of SiO2 films: oxygen plasma diagnostic
Silicon oxide is deposited by remote microwave plasma enhanced chemical vapour deposition (RMPECVD). The silica films are produced by exciting oxygen in a microwave discharge while a mixture of 5% of silane diluted in argon is introduced downstream. In the afterglow, double Langmuir probe measurements and rotational temperatures deduced from optical emission spectroscopy (OES), show that the electron energy is transferred to the gas when the pressure increases (19 - 26 Pa). Therefore the electronic temperature decreases from 22000 to 11000 K and the gas temperature increases from 400 to 500 K. Moreover the microwave power (180 -480 W) has an influence on the deposition rate and on the quality of SiO 2 coatings (density and etch rate in an HF solution). This effect can be correlated with the increase in the electron density (0.7.10 10 to 3.7.10 10 cm -3 ) and of the gas temperature (400 to 460 K).
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