{"title":"紧凑的多瓦QCL模块","authors":"F. Münzhuber, L. Späth, H. Tholl","doi":"10.1117/12.2636264","DOIUrl":null,"url":null,"abstract":"We report on the realization of a multi-emitter quantum cascade laser system with optimized package volume. A multidimensional bonding of chip-on-substrate units allows for close packaging of several chips. The emission of several chip-on-substrate units with an emission wavelength around 3.9 µm are geometrically combined to achieve a multi-Watt emission power level while obtaining a symmetric beam profile of the emission. A dedicated integrated electronic circuit provides individual pulse control, which enables individual timing for each emitter.","PeriodicalId":52940,"journal":{"name":"Security and Defence Quarterly","volume":"10 5 1","pages":"122730G - 122730G-12"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Compact multi-watt QCL module\",\"authors\":\"F. Münzhuber, L. Späth, H. Tholl\",\"doi\":\"10.1117/12.2636264\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report on the realization of a multi-emitter quantum cascade laser system with optimized package volume. A multidimensional bonding of chip-on-substrate units allows for close packaging of several chips. The emission of several chip-on-substrate units with an emission wavelength around 3.9 µm are geometrically combined to achieve a multi-Watt emission power level while obtaining a symmetric beam profile of the emission. A dedicated integrated electronic circuit provides individual pulse control, which enables individual timing for each emitter.\",\"PeriodicalId\":52940,\"journal\":{\"name\":\"Security and Defence Quarterly\",\"volume\":\"10 5 1\",\"pages\":\"122730G - 122730G-12\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-11-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Security and Defence Quarterly\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2636264\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Security and Defence Quarterly","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2636264","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We report on the realization of a multi-emitter quantum cascade laser system with optimized package volume. A multidimensional bonding of chip-on-substrate units allows for close packaging of several chips. The emission of several chip-on-substrate units with an emission wavelength around 3.9 µm are geometrically combined to achieve a multi-Watt emission power level while obtaining a symmetric beam profile of the emission. A dedicated integrated electronic circuit provides individual pulse control, which enables individual timing for each emitter.
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