集成电路处理静电微电机

Long-Shen Fan, Yu-Chong Tai, Richard S. Muller
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引用次数: 24

摘要

本文介绍了几种采用集成电路工艺生产的微电机的设计、制造和运行情况。这些电机的转子和定子都是由1.0-1.5 μm厚的多晶硅制成的,由静电力驱动。被测电机的转子直径在60 ~ 120 μm之间。使用磷硅酸盐玻璃(PSG)作为牺牲材料和一种或三种多晶硅沉积,已经制造了几种减少摩擦设计的电机。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
IC-processed electrostatic micromotors

We describe the design, fabrication and operation of several micromotors that have been produced using integrated-circuit processing. Both rotors and stators for these motors, which are driven by electrostatic forces, are formed from polycrystalline silicon 1.0–1.5 μm thick. The diameters of the rotors in the motors tested are between 60 and 120 μm. Motors with several friction-reducing designs have been fabricated using phosphosilicate glass (PSG) as a sacrificial material and either one or three polysilicon depositions.

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