{"title":"在工艺变化下提高片上数据缓存的可靠性","authors":"Wei Wu, S. Tan, Jun Yang, Shih-Lien Lu","doi":"10.1109/ICCD.2007.4601920","DOIUrl":null,"url":null,"abstract":"On-chip caches take a large portion of the chip area. They are much more vulnerable to parameter variation than smaller units. As leakage current becomes a significant component of the total power consumption, the leakage current variations induced thermal and reliability problem to the on-chip caches become an important design concern. This paper studies the impact of process variations, particular the leakage variations, on the temperature and reliability of on-chip caches. Our statistical simulation shows that, under process variation, 85% of the caches see shortened lifetime, with average lifetime being 81.6% of the ideal cache. At runtime, unevenly distributed dynamic power and the corresponding thermal variation would further deteriorate the situation. To mitigate this problem, we propose a dynamic cache subarray permutation scheme that can alleviate the thermal stress on a high-leakage area to improve the reliability of the caches. Experiments on 17 Spec2k benchmarks show that our scheme can extend the cache lifetime by up to 20.3%, and reduce the peak temperature by 7 degrees on average and more on data-intensive applications.","PeriodicalId":6306,"journal":{"name":"2007 25th International Conference on Computer Design","volume":"13 1","pages":"325-332"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Improving the reliability of on-chip data caches under process variations\",\"authors\":\"Wei Wu, S. Tan, Jun Yang, Shih-Lien Lu\",\"doi\":\"10.1109/ICCD.2007.4601920\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"On-chip caches take a large portion of the chip area. They are much more vulnerable to parameter variation than smaller units. As leakage current becomes a significant component of the total power consumption, the leakage current variations induced thermal and reliability problem to the on-chip caches become an important design concern. This paper studies the impact of process variations, particular the leakage variations, on the temperature and reliability of on-chip caches. Our statistical simulation shows that, under process variation, 85% of the caches see shortened lifetime, with average lifetime being 81.6% of the ideal cache. At runtime, unevenly distributed dynamic power and the corresponding thermal variation would further deteriorate the situation. To mitigate this problem, we propose a dynamic cache subarray permutation scheme that can alleviate the thermal stress on a high-leakage area to improve the reliability of the caches. Experiments on 17 Spec2k benchmarks show that our scheme can extend the cache lifetime by up to 20.3%, and reduce the peak temperature by 7 degrees on average and more on data-intensive applications.\",\"PeriodicalId\":6306,\"journal\":{\"name\":\"2007 25th International Conference on Computer Design\",\"volume\":\"13 1\",\"pages\":\"325-332\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 25th International Conference on Computer Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2007.4601920\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 25th International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2007.4601920","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improving the reliability of on-chip data caches under process variations
On-chip caches take a large portion of the chip area. They are much more vulnerable to parameter variation than smaller units. As leakage current becomes a significant component of the total power consumption, the leakage current variations induced thermal and reliability problem to the on-chip caches become an important design concern. This paper studies the impact of process variations, particular the leakage variations, on the temperature and reliability of on-chip caches. Our statistical simulation shows that, under process variation, 85% of the caches see shortened lifetime, with average lifetime being 81.6% of the ideal cache. At runtime, unevenly distributed dynamic power and the corresponding thermal variation would further deteriorate the situation. To mitigate this problem, we propose a dynamic cache subarray permutation scheme that can alleviate the thermal stress on a high-leakage area to improve the reliability of the caches. Experiments on 17 Spec2k benchmarks show that our scheme can extend the cache lifetime by up to 20.3%, and reduce the peak temperature by 7 degrees on average and more on data-intensive applications.