用于CE器件的DSP核的结构混淆

A. Sengupta, S. Mohanty
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引用次数: 0

摘要

前面的章节,水印,指纹和法医工程已经讨论了解决各种所有权相关的问题。本章讨论了阻止IP盗版和逆向工程(RE)的结构混淆方法。这种方法,如果有效,可以节省数十亿美元的收入损失在CE和半导体行业。特别是针对DSP IP核,提出了一种基于多层转换的结构混淆处理方法作为硬件硬化技术。本章的结构如下:第7.2节强调混淆的基本原理,强调结构混淆;第7.3节讨论了不同的编译器转换驱动的结构混淆方法。第7.4节讨论了低成本的结构模糊设计探索技术。第7.5节通过一个激励性的例子演示了多阶段结构混淆技术。第7.6节给出了一个案例研究的结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Structural obfuscation of DSP cores used in CE devices
Previous chapters, watermarking, fingerprinting, and forensic engineering have been discussed for resolving various ownership-related problems. This chapter discusses structural obfuscation approaches to thwart IP piracy and reverse engineering (RE). This approach, when effective, can save billions of dollars of revenue losses in CE and semiconductor industry. Especially, a multi-high-level transformation-based structural obfuscation process has been presented for DSP IP cores as hardware-hardening technique. The chapter is structured as follows: Section 7.2 highlights the fundamentals of obfuscation with stress on structural obfuscation; Section 7.3 discusses different compiler transformation-driven structural obfuscation methodology. Section 7.4 discusses low-cost structurally obfuscated design exploring technique. Section 7.5 demonstrates a multistage structural obfuscation technique through a motivational example. Section 7.6 presents the results of a case study.
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