材料对背触点模块可靠性的影响

M. Guichoux, C. Tjengdrawira, D. Veldman, P. D. de Jong
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引用次数: 3

摘要

本文讨论了密封剂、导电胶粘剂和背片箔的几种组合对ECN背接触模块性能和可靠性的影响。湿热(85°C;85% R.H)和热循环(- 40°C;+85°C)测试的执行时间是IEC-61215标准所述时间的两倍,即2000小时的湿热和400个热循环。这些测试已被确定为该技术最重要的测试。经过气候室测试,对组件进行了视觉分析和电致发光成像。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of materials on back-contact module reliability
This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN's back-contact modules performance and reliability. Damp-heat (85°C; 85% R.H) and thermal cycling (−40°C; +85°C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.
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