低激发下缺陷区gan基LED芯片的光致发光和电致发光特性

Jongseok Kim, SeungTaek Kim, HyungTae Kim, Sungbok Kang, H. Jeong, Hyundon Jung
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引用次数: 0

摘要

采用光致发光(PL)成像方法可以观察到LED外延片和芯片片的缺陷区域。由于缺陷区含有高密度的非辐射复合中心,有缺陷区的LED芯片表现出与无缺陷区的LED芯片不同的光学特性。在较低的光激发功率水平下,非辐射复合对光致发光性能的影响较大。在低电激发水平下,电致发光(EL)特性也观察到类似的现象。给出了LED芯片发光特性和发光特性的异同研究结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Photoluminescence and electroluminescence properties of GaN-based LED chips with defective regions at low excitation levels
Defective regions of LED epi-wafers and chip-wafers could be observed by a photoluminescence (PL) imaging method. As the defective regions contain high density nonradiative recombination centers, the LED chips with defective regions showed different optical properties from those of LEDs with no defective regions found by PL imaging. At low optical excitation power levels, the PL properties were influenced by nonradiative recombination dominantly. Similar phenomena were observed from electroluminescence (EL) properties at low electrical excitation levels. Research results on the similarity and difference between PL and EL properties of LED chips are presented.
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