{"title":"电流对焊料凝固的影响","authors":"J. Skácel, A. Otáhal, I. Szendiuch","doi":"10.1109/ISSE.2019.8810308","DOIUrl":null,"url":null,"abstract":"This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscophy.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"68 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Influence of Electric Current at Solidification of Solder\",\"authors\":\"J. Skácel, A. Otáhal, I. Szendiuch\",\"doi\":\"10.1109/ISSE.2019.8810308\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscophy.\",\"PeriodicalId\":6674,\"journal\":{\"name\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"volume\":\"68 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 42nd International Spring Seminar on Electronics Technology (ISSE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2019.8810308\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810308","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Influence of Electric Current at Solidification of Solder
This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz glass tube where the brass electrodes were placed at each end of the tube. There have been tested two possibilities, with electric current and without current flow. The used inspection method was the optical inspection of micro-section cut with SEM microscophy.
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