采用数字合金方法对等子盖层厚度和变化子盖层厚度的InAs量子点异质结构进行了比较分析

Ravindra Kumar, Ajay Kumar, J. Saha, S. Chakrabarti
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引用次数: 0

摘要

本研究利用数字合金方法,研究了InAs量子点异质结构InGaAs应变还原层(SRL)的亚封盖厚度变化。采用数字合金法将常规结构(试样A)的6 nm SRL厚度与2 nm厚度(试样B)等分。此外,使用这种方法,样品C (1 nm, 2 nm和3 nm)和样品D (3 nm, 2 nm和1 nm)从InAs QD到顶部GaAs层的厚6 nm封盖以不相等的方式划分。样品A的SRL内的In-content为15%,而其他样品的划分SRL内的In-content分别为45%、30%和15%。srl的这种组成有助于减少in -out扩散,最大限度地减少InAs QD-SRL和srl -顶部GaAs层界面的晶格失配,也减少了整体异质结构内部的应变。利用Nextnano计算了所有结构的静力应变和双轴应变,并进行了比较。与A、B、C试样相比,D试样QD内静压应变分别降低了4.74%、1.07%、2.269%,双轴应变分别提高了1.66%、0.696%、1.276%。计算得到样品A、B、C和D的发光波长分别为1305 nm、1365 nm、1349 nm和1375 nm。因此,样品D是制造未来光电器件的最佳选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A comparative analysis of InAs quantum dot heterostructure with equal and varying sub-capping layer thickness using digital alloy approach
In current study, the variation of sub-capping thickness of InGaAs strain reducing layer (SRL) of InAs quantum dot heterostructure using digital alloy approach is presented. The thickness of 6 nm SRL of conventional structure (sample A) is divided equally with 2 nm thickness (sample B) by using digital alloy approach. Further, using such approach, this thick 6 nm capping is divided in unequal fashion for sample C (1 nm, 2 nm and 3 nm) and sample D (3 nm, 2 nm and 1 nm) from InAs QD towards top GaAs layer. The In-content inside the SRL of the sample A is 15%, whereas, In-content inside the divided-SRL is considered as 45%, 30% and 15% for all other samples. Such composition of SRLs helps in reducing the In-out diffusion, minimizing the lattice mismatch at InAs QD-SRL and SRL-top GaAs layer interfaces, and also reduces the strain inside the overall heterostructures. Two strains, namely hydrostatic and biaxial are calculated by using Nextnano for all the structures and compared simultaneously. The hydrostatic strain inside the QD of sample D is reduced by 4.74%, 1.07% and 2.269% and the biaxial strain inside the QD of sample D is improved by 1.66%, 0.696% and 1.276% as compared to that of samples A, B and C, respectively. The computed PL emission of samples A, B, C and D are observed to be 1305 nm, 1365 nm, 1349 nm and 1375 nm, respectively. Hence, sample D is the optimum choice for fabricating future opto-electronic devices.
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