Session 5 overview: Image sensors: IMMD subcommittee

The session presents advances in image sensors covering BSI, global shuttering, organic photoconductive film, pixel scaling, dynamic vision, high frame rate imaging, 3D time-of-flight, and SPADs. The first paper, by Sony, presents a BSI global shutter with in-pixel ADC. Then, Panasonic presents a global shutter using organic film with in-pixel noise cancellation. Samsung presents a 0.9μm pixel with complete deep-trench isolation. Sony presents a low-power event-driven imager with motion detection. TSMC presents a 13.5Mpixel BSI image sensor with a readout subsampling architecture that allows 514fps at 720p. NHK presents a high-speed image sensor achieving 8K video up to 480fps. Toshiba presents a LiDAR SoC enabling range measurements up to 200m. Microsoft presents a BSI time-of-flight image sensor with 3.5μm global-shutter pixels with modulation frequencies up to 320MHz. Delft University presents a direct time-of-flight image sensor with modular SPAD-based pixel arrays fabricated in 3D-stacked 45/65nm CMOS. Finally, FBK presents a SPAD array coupled with TDCs to measure spatial correlations of entangled photons at a rate of 800kHz.