GaAs Gunn材料中的离子注入阴极掺杂缺口

A. Ezis, D.V. Morgan, M.J. Howes
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引用次数: 2

摘要

研究了用离子注入法在GaAs Gunn材料中制备阴极掺杂缺口的方法。研究了两种技术:用p型掺杂剂、磁离子或补偿氧离子注入n+-n-n2+结构的外延GaAs。或者,在没有n+接触层的Gunn材料中注入n型掺杂剂硒离子和p型镁离子,以形成阴极凹口配置。在这两种情况下,退火都是在砷蒸汽超压下进行的。研究发现,在注入后退火过程中,杂质扩散的程度决定了产生的缺口的大小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ion implanted cathode doping notches in GaAs Gunn material

The fabrication of cathode doping notches in GaAs Gunn material by use of ion implantation has been investigated. Two techniques were studied: Epitaxial GaAs having an n+-n-n2+ structure was implanted with either p-type dopant, magnetium ions, or compensating oxygen ions. Alternatively Gunn material, without an n+ contact layer, was implanted with both n-type dopant selenium ions and p-type magnesium ions to form the cathode-notch configuration. In both cases annealing was carried out in an arsenic vapour overpressure. It is found that the magnitude of notches produced is governed by the extent to which impurity diffusion takes place during post-implant annealing.

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