二氧化硅粒径和填料含量对环氧树脂复合材料断裂性能的影响

IF 1.1 4区工程技术 Q4 Engineering

High Temperatures-high Pressures Pub Date : 2021-01-01 DOI:10.32908/hthp.v50.999

Zafer Azem, U. Malayoğlu, B. Uyulgan

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引用次数: 0

摘要

用二氧化硅颗粒作为填料制备了硅-环氧复合材料。采用粒径分别为1 μm和37 μm，填料含量分别为20、30、40和60 wt. %的二氧化硅颗粒，研究了粒径和填料含量对环氧树脂复合材料断裂行为的影响。采用ASTM-D5045标准的线弹性断裂力学方法表征复合材料的断裂行为，采用三点弯曲试验方法对复合材料的平面应变断裂韧性(Kıc)和应变能释放率(Gıc)进行了测试。用差示扫描量热法(DSC)测定了样品的玻璃化瞬态温度。用扫描电镜对试样的断口形貌进行了分析。当填充量为60 wt. %、粒径为37 μm时，杨氏模量最高为10.48 GPa，而未填充的环氧树脂的杨氏模量为3.05 MPa时，杨氏模量有较大的提高。实验结果表明，二氧化硅填充的环氧复合材料的断裂韧性值比未填充的环氧复合材料提高了98%。

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Effect of silica particle size and filler content on the fracture properties of epoxy resin composite

Silica particles were used as a filler to produce silica-epoxy composite. Silica particles with two mean diameters of 1 μm and 37 μm and filler content of 20, 30, 40, and 60 wt. % were used to investigate the effect of particle size and filler content on the fracture behavior of epoxy resin composite, respectively. The fractural behavior of composites was characterized by linear elastic fracture mechanics according to standard of ASTM-D5045 in which three-point bending test procedure was used to investigate plane-strain fracture toughness (Kıc) and strain energy release rate (Gıc) of the composite specimens. Glass transient temperatures of the samples were evaluated by using differential scanning calorimetry (DSC). Fracture surfaces of the produced specimens were examined by SEM. The highest Young’s modulus value was 10.48 GPa for the sample produced with 37 μm particle size and 60 wt. % filler content and it was found that a considerable increase was obtained according to the 3.05 MPa values of the unfilled epoxy. Experimental results show that fracture toughness value of the silica filled epoxy composite was improved by 98% compared to unfilled epoxy.

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来源期刊

High Temperatures-high Pressures THERMODYNAMICS-MECHANICS

CiteScore

1.00

自引率

9.10%

发文量

期刊介绍： High Temperatures – High Pressures (HTHP) is an international journal publishing original peer-reviewed papers devoted to experimental and theoretical studies on thermophysical properties of matter, as well as experimental and modelling solutions for applications where control of thermophysical properties is critical, e.g. additive manufacturing. These studies deal with thermodynamic, thermal, and mechanical behaviour of materials, including transport and radiative properties. The journal provides a platform for disseminating knowledge of thermophysical properties, their measurement, their applications, equipment and techniques. HTHP covers the thermophysical properties of gases, liquids, and solids at all temperatures and under all physical conditions, with special emphasis on matter and applications under extreme conditions, e.g. high temperatures and high pressures. Additionally, HTHP publishes authoritative reviews of advances in thermophysics research, critical compilations of existing data, new technology, and industrial applications, plus book reviews.