玻璃或聚酰亚胺基板上金微加热器厚度及界面热阻分析

IF 1.1 4区工程技术 Q4 Engineering

High Temperatures-high Pressures Pub Date : 2021-01-01 DOI:10.32908/hthp.v50.1073

H. Kim, Woong Ko, D. Oh

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引用次数: 2

摘要

3ω方法被广泛用于测量衬底或薄膜的热性能，在衬底或薄膜上沉积了微加热器。最近，使用双向3ω方法分析了具有非正式形状且导热系数为1 W/mK或以下的样品。在测量此类样品的热导率时，可以使用在低热导率衬底(如玻璃或聚酰亚胺)上制造的3ω传感器来提高测量灵敏度和精度。在本研究中，对沉积在玻璃和聚酰亚胺基板上的微加热器进行了热表征，用于3ω传感器。分析了微加热器厚度和衬底与微加热器之间的界面热阻对温度幅值和相位滞后的影响。将考虑微加热器厚度和界面热阻的解析解与二维导热数值分析和实验结果进行了比较。

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Analysis of thickness and interfacial thermal resistance of Au microheater on glass or polyimide substrate

The 3ω method is widely used for measuring the thermal properties of a substrate or thin film on which a microheater is deposited. Recently, samples with non-formal shapes and has a thermal conductivity of 1 W/mK or below have been analyzed using the bidirectional 3ω method. In measuring the thermal conductivity of such samples, the measurement sensitivity and accuracy can be increased using a 3ω sensor fabricated on a low thermal conductivity substrate such as glass or polyimide. In this study, thermal characterization is conducted on a microheater deposited on glass and polyimide substrates for a 3ω sensor. The effects of the microheater thickness and the interfacial thermal resistance between the substrate and microheater, on the temperature amplitude and phase lag are analyzed. Results from analytic solutions considering the microheater thickness and the interfacial thermal resistance are compared with results from numerical analysis of two-dimensional conduction heat transfer and experiment.

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来源期刊

High Temperatures-high Pressures THERMODYNAMICS-MECHANICS

CiteScore

1.00

自引率

9.10%

发文量

期刊介绍： High Temperatures – High Pressures (HTHP) is an international journal publishing original peer-reviewed papers devoted to experimental and theoretical studies on thermophysical properties of matter, as well as experimental and modelling solutions for applications where control of thermophysical properties is critical, e.g. additive manufacturing. These studies deal with thermodynamic, thermal, and mechanical behaviour of materials, including transport and radiative properties. The journal provides a platform for disseminating knowledge of thermophysical properties, their measurement, their applications, equipment and techniques. HTHP covers the thermophysical properties of gases, liquids, and solids at all temperatures and under all physical conditions, with special emphasis on matter and applications under extreme conditions, e.g. high temperatures and high pressures. Additionally, HTHP publishes authoritative reviews of advances in thermophysics research, critical compilations of existing data, new technology, and industrial applications, plus book reviews.