Dong Changdao (董昌道), Zhou Qiang (周强), Cai Yici (蔡懿慈), Liu Dawei (刘大为)
{"title":"考虑CMP变化的线密度均匀性的基于分区的全局布局","authors":"Dong Changdao (董昌道), Zhou Qiang (周强), Cai Yici (蔡懿慈), Liu Dawei (刘大为)","doi":"10.1016/S1007-0214(11)70007-4","DOIUrl":null,"url":null,"abstract":"<div><p>This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations. The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution. The global placement is based on a top-down recursive bisection framework. The partitioning algorithm is used in the bisectioning to impact the wire density uniformity. Tests show that, with a 10% constraint, the partitioning produces solutions with more balanced edge weights that are 837% better than from hMetis, 1039.1% better than MLPart, and 762.9% better than FM in terms of imbalance proportion and that this global placement algorithm improves ROOSTER with a more uniform wire distribution by 3.1% on average with an increased wire length of only 3.0%.</p></div>","PeriodicalId":60306,"journal":{"name":"Tsinghua Science and Technology","volume":null,"pages":null},"PeriodicalIF":5.2000,"publicationDate":"2011-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/S1007-0214(11)70007-4","citationCount":"2","resultStr":"{\"title\":\"Partition-Based Global Placement Considering Wire-Density Uniformity for CMP Variations*\",\"authors\":\"Dong Changdao (董昌道), Zhou Qiang (周强), Cai Yici (蔡懿慈), Liu Dawei (刘大为)\",\"doi\":\"10.1016/S1007-0214(11)70007-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations. The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution. The global placement is based on a top-down recursive bisection framework. The partitioning algorithm is used in the bisectioning to impact the wire density uniformity. Tests show that, with a 10% constraint, the partitioning produces solutions with more balanced edge weights that are 837% better than from hMetis, 1039.1% better than MLPart, and 762.9% better than FM in terms of imbalance proportion and that this global placement algorithm improves ROOSTER with a more uniform wire distribution by 3.1% on average with an increased wire length of only 3.0%.</p></div>\",\"PeriodicalId\":60306,\"journal\":{\"name\":\"Tsinghua Science and Technology\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":5.2000,\"publicationDate\":\"2011-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/S1007-0214(11)70007-4\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Tsinghua Science and Technology\",\"FirstCategoryId\":\"1093\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1007021411700074\",\"RegionNum\":1,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"COMPUTER SCIENCE, INFORMATION SYSTEMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Tsinghua Science and Technology","FirstCategoryId":"1093","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1007021411700074","RegionNum":1,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"COMPUTER SCIENCE, INFORMATION SYSTEMS","Score":null,"Total":0}
Partition-Based Global Placement Considering Wire-Density Uniformity for CMP Variations*
This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations. The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution. The global placement is based on a top-down recursive bisection framework. The partitioning algorithm is used in the bisectioning to impact the wire density uniformity. Tests show that, with a 10% constraint, the partitioning produces solutions with more balanced edge weights that are 837% better than from hMetis, 1039.1% better than MLPart, and 762.9% better than FM in terms of imbalance proportion and that this global placement algorithm improves ROOSTER with a more uniform wire distribution by 3.1% on average with an increased wire length of only 3.0%.