含Sc 7075T-6合金RSW接头组织与力学性能研究

IF 1.3 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
Chao-pin Ma, Jun Shen, Hao Li, C. Zeng, Fuxing Xie
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引用次数: 1

摘要

目前,电阻点焊是汽车等行业常用的焊接方法,而7000系铝合金因其强度高、易切削加工,已成为一种非常常用的工业材料。钪(Sc)是一种常用的合金强化材料,但对含Sc的铝合金电阻点焊接头的研究较少。本文选取含少量Sc的7075-T6合金,研究其电阻点焊接头的可焊性。模拟结果表明,铝片表面之间的有效接触面积约为19.5%,这是影响成核的重要因素。当Sc的添加量为0 ~ 0.4 wt%时,熔核的平均晶粒尺寸由51.51±5.74 μm减小到8.15±1.09 μm,这主要是由于Al3Sc颗粒在熔体中起非均相核的作用。试验结果表明,Sc添加量为0.4 wt%时,由于晶粒细化强化,焊接接头的抗拉剪切强度比未添加Sc的焊接接头高29.2%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research on microstructure and mechanical properties of RSW joints of 7075T-6 alloy containing Sc
Nowadays, Resistance spot welding is a common welding method used in automobiles and other industries, and 7000 series Al alloy has become a very common industrial material because of its high strength and easy machinability. Scandium (Sc) is often used for alloy strengthening, however, there are few studies on resistance spot welding joint of Al alloy containing Sc. Here, 7075-T6 alloys containinga small amount of Sc were obtained to investigate the joint of resistance spot weldability. The simulation shows that the effective contact area between the Al sheet surface is about 19.5%, which is an important factor in nucleation. It has been found that the average grain size of the nugget decreased from 51.51 ± 5.74 μm to 8.15 ± 1.09 μm when Sc was added from 0 to 0.4 wt%, which is mainly due to the Al3Sc particles acting as the heterogeneous nucleus in the melt. The test results show that the tensile shear strength of welded joints with 0.4 wt% Sc addition is 29.2% higher than that of the joints without Sc because of grain refine strengthening.
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来源期刊
Emerging Materials Research
Emerging Materials Research MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.50
自引率
9.10%
发文量
62
期刊介绍: Materials Research is constantly evolving and correlations between process, structure, properties and performance which are application specific require expert understanding at the macro-, micro- and nano-scale. The ability to intelligently manipulate material properties and tailor them for desired applications is of constant interest and challenge within universities, national labs and industry.
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