新型电子封装水泥陶瓷封装材料

{"title":"新型电子封装水泥陶瓷封装材料","authors":"Stefan Käßner, Nadja Wichtner, C. Berthold, K. Nickel","doi":"10.15496/PUBLIKATION-31007","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":48807,"journal":{"name":"Journal of Ceramic Science and Technology","volume":null,"pages":null},"PeriodicalIF":0.5000,"publicationDate":"2018-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Novel Cement-Ceramic Encapsulation Material for Electronic Packaging\",\"authors\":\"Stefan Käßner, Nadja Wichtner, C. Berthold, K. Nickel\",\"doi\":\"10.15496/PUBLIKATION-31007\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":48807,\"journal\":{\"name\":\"Journal of Ceramic Science and Technology\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.5000,\"publicationDate\":\"2018-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Ceramic Science and Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.15496/PUBLIKATION-31007\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Ceramic Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.15496/PUBLIKATION-31007","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}