微波加热无铅焊料回流

Q4 Engineering

International Journal of Materials and Structural Integrity Pub Date : 2014-09-15 DOI:10.1504/IJMSI.2014.064771

Y. Ju, H. Yamauchi, H. Oshima, Kensuke Tanaka

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引用次数: 2

摘要

最近，由于铅可能对人类和环境产生不良影响，禁止在印刷基板和电气封装之间的互连中使用含铅焊料。今天，Sn-Ag-Cu合金(SnAgCu)通常被用作Sn-Pb合金(SnPb)的替代品。然而，SnAgCu的熔点高于SnPb，这可能导致衬底和封装的损伤。为解决这一问题，对微波加热无铅焊料的回流进行了研究。微波加热系统在TE10模式下工作在2.45 GHz频率。通过同时测量衬底和焊料的温度，研究了波导中最合适的加热位置和最合适的微波功率。将焊料加热至熔点493 K后，实现了焊料安装。用SEM观察了钎料与Cu之间的金属间化合物，并用EDX对钎料的横截面进行了分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reflow of lead-free solder by microwave heating

Recently, the use of solder containing lead in the interconnection between printed substrate and electric packages has been prohibited since lead may have a bad influence on humans and the environment. Today Sn-Ag-Cu alloys (SnAgCu) are used in general as a substitute of Sn-Pb alloys (SnPb). However, the melting point of SnAgCu is higher than that for SnPb which may induce damages in the substrate and packages. To solve this problem, the reflow of lead-free solder by microwave heating was studied. The microwave heating system worked at 2.45 GHz frequency on TE10 mode. The most suitable heating location in the waveguide and the most suitable microwave power were investigated by measuring the temperature of the substrate and the solder simultaneously. After the solder was heated up to the melting point of 493 K, solder-mounted was achieved. The intermetallic chemical compound between the solder and Cu was observed by SEM and it was also analysed by the cross-section of the solder using EDX.

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来源期刊

International Journal of Materials and Structural Integrity Engineering-Mechanical Engineering

CiteScore

0.40

自引率

0.00%

发文量