塑料球栅阵列封装焊点热疲劳寿命预测

Q4 Engineering

International Journal of Materials and Structural Integrity Pub Date : 2014-09-15 DOI:10.1504/IJMSI.2014.064769

Y. Chu, S. Yi, P. Geng

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引用次数: 4

摘要

采用有限元法对热循环条件下塑料球栅阵列封装(PBGA)焊点的疲劳寿命进行了研究。为了提高可靠性预测的准确性，采用了统一的塑料球栅阵列封装焊点粘塑性本构模型。然后将本构模型应用于商用有限元分析软件ABAQUS中，以预测PBGA封装中焊球在热循环下的热力学行为。从有限元分析结果中获得损伤参数，并用于估计焊球的热疲劳寿命。采用Coffin-Manson方程。对预测的热疲劳寿命进行了详细的讨论。

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Thermal fatigue life prediction of solder joints of plastic ball grid array packages

In the present study, the fatigue life of solder joints of plastic ball grid array packages (PBGA) under thermal cycling condition is evaluated using the finite element method. A unified, viscoplastic constitutive model for solder joints of plastic ball grid array packages is employed to improve accuracy of reliability prediction. The constitutive model is then implemented into the commercial finite element analysis software, ABAQUS, to predict the thermo-mechanical behaviour of solder balls in PBGA package subjected to thermal cycling. Damage parameters are obtained from the FEA results and are used to estimate the thermal fatigue life of solder balls. The Coffin-Manson equation is employed. The predicted thermal fatigue lives are discussed in detail.

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来源期刊

International Journal of Materials and Structural Integrity Engineering-Mechanical Engineering

CiteScore

0.40

自引率

0.00%

发文量