利用多孔层来减少离子注入过程中产生的辐射缺陷

E. Pankratov, E. Bulaeva
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引用次数: 1

摘要

最近有研究表明,在半导体异质结构中制造一种注入结整流器,使注入离子的能量、材料和辐射缺陷退火后异质结构层厚度之间的关系达到最佳,这使我们有可能提高p-n结的锐度,同时增加掺杂区域中掺杂剂分布的均匀性[1,2]。本文考虑了利用多孔外延层来减少离子注入过程中产生的辐射缺陷的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Using porous layers to decrease quantity of radiation defects, generated during ion implantation
It has been recently shown that manufacturing of an implanted-junction rectifier in a semiconductor heterostructure for optimal relationship between energy of implanted ions, materials and thicknesses of layers of the heterostructure after annealing of radiation defects gives us possibility to increase sharpness of p-n- junction and at the same time to increase homogeneity of dopant distribution in doped area [1,2]. In this paper we consider a possibility to decrease quantity of radiation defects, which were generated during ion implantation, using porous epitaxial layers of the heterostructure.
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