玻璃中间体中通孔的超适形填充

ECS Electrochemistry Letters Pub Date : 2014-01-01 DOI:10.1149/2.0081408EEL

P. Ogutu, E. Fey, N. Dimitrov

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引用次数: 9

摘要

添加剂四硝基蓝氯化四氮唑(TNBT)已成功应用于玻璃中间体(TGVs)宽高比为6的过孔超适形填充(SCF)。tgv最初使用较早开发的混合方法涂覆薄共形Cu。在含0.88M CuSO4、40 ppm TNBT、40 ppm Cl−、0.1M CH3COOH和0.6M Na2SO4的停滞液中，在电流密度为2.5 mA/cm2的条件下，通过优化电镀参数和镀液组成，这些tgv仅在3小时内就实现了SCF。这是使用直流电镀和单一添加剂系统的AR的最短填充时间。©2014电化学学会。[DOI: 10.1149/2.0081408eel]版权所有

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Superconformal Filling of Through Vias in Glass Interposers

The additive tetranitroblue tetrazolium chloride (TNBT) has been applied successfully in this work to superconformal filling (SCF) of through-vias with an aspect ratio (AR) of 6 in glass interposers (TGVs). The TGVs were initially coated with thin conformal Cu using an earlier developed hybrid method. Optimization of plating parameters and bath composition led to SCF of these TGVs in only 3 h at a current density of 2.5 mA/cm2 in a stagnant bath containing 0.88M CuSO4, 40 ppm TNBT, 40 ppm Cl−, 0.1M CH3COOH, and 0.6M Na2SO4. This is the shortest reported filling time for this AR using DC plating and a single-additive system. © 2014 The Electrochemical Society. [DOI: 10.1149/2.0081408eel] All rights reserved.

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ECS Electrochemistry Letters ELECTROCHEMISTRY-MATERIALS SCIENCE, MULTIDISCIPLINARY

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