{"title":"高亮度发光二极管(HB LED)封装中焊点的热阻","authors":"Y. Yoon, Jin-Woo Park","doi":"10.1109/TCAPT.2009.2033414","DOIUrl":null,"url":null,"abstract":"We present a framework to calculate the thermal resistance of Au-Sn eutectic solder joint (Rth, Au-Sn joint) in high brightness light emitting diode (HB LED) packages whose heat extraction capability controls the optical efficiency and reliability of HB LEDs. Using the transient thermal measurement combined with the structure function based analytical method and the finite element method, we find that the thermal conductivity (k) of the thin solder joint becomes significantly smaller than the Au-Sn alloy after joining; hence, Rth, Au-Sn joint constitutes a large portion of the total Rth of the package (Rth PKG).","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"32 1","pages":"825-831"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2009.2033414","citationCount":"18","resultStr":"{\"title\":\"The Thermal Resistance of Solder Joints in High Brightness Light Emitting Diode (HB LED) Packages\",\"authors\":\"Y. Yoon, Jin-Woo Park\",\"doi\":\"10.1109/TCAPT.2009.2033414\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a framework to calculate the thermal resistance of Au-Sn eutectic solder joint (Rth, Au-Sn joint) in high brightness light emitting diode (HB LED) packages whose heat extraction capability controls the optical efficiency and reliability of HB LEDs. Using the transient thermal measurement combined with the structure function based analytical method and the finite element method, we find that the thermal conductivity (k) of the thin solder joint becomes significantly smaller than the Au-Sn alloy after joining; hence, Rth, Au-Sn joint constitutes a large portion of the total Rth of the package (Rth PKG).\",\"PeriodicalId\":55013,\"journal\":{\"name\":\"IEEE Transactions on Components and Packaging Technologies\",\"volume\":\"32 1\",\"pages\":\"825-831\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/TCAPT.2009.2033414\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components and Packaging Technologies\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TCAPT.2009.2033414\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components and Packaging Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TCAPT.2009.2033414","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Thermal Resistance of Solder Joints in High Brightness Light Emitting Diode (HB LED) Packages
We present a framework to calculate the thermal resistance of Au-Sn eutectic solder joint (Rth, Au-Sn joint) in high brightness light emitting diode (HB LED) packages whose heat extraction capability controls the optical efficiency and reliability of HB LEDs. Using the transient thermal measurement combined with the structure function based analytical method and the finite element method, we find that the thermal conductivity (k) of the thin solder joint becomes significantly smaller than the Au-Sn alloy after joining; hence, Rth, Au-Sn joint constitutes a large portion of the total Rth of the package (Rth PKG).
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