使用脉冲电流技术电沉积铂

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY

Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871261

S. E. Hadian, D. Gabe

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引用次数: 0

摘要

脉冲镀的范围已经在铂镀层的制造生产的背景下被定义。研究了电解质变量对P盐溶液电流效率的影响。比较了常规电流和脉冲电流下的沉积性能，并注意到电流效率的提高。

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The use of pulsed current techniques for electrodeposition of platinum

The scope of pulse plating has been defined in the context of the manufacturing production of platinum electrodeposits. The influence of electrolyte variables on the current efficiency has been investigated for P salt solution. Deposition performances under conventional and pulsed current have been compared and increases in current efficiency noted.

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来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.